Thursday, February 7, 2013

EDI CON 2013: Gathering Design Engineers

Design engineers and system integrators will be gathering at the Beijing International Convention Center from March 12-14 for the Electronic Design Innovation Conference (EDI CON) and, as an official gold sponsor of the event, CST will be there too.

You can take a sneak peek at the conference program which includes a CST workshop on 'Integrated Antenna Design for a GSM Tracking Device' and a technical paper on 'Signal Lines to Power Plane Coupling Caused by Common Mode Current in High Speed SerDes Interconnect Design.'

The technical conference and exhibition will allow attendees to learn about the latest challenges and solutions in the RF, microwave, EMC/EMI and high-speed electronics industries. Guests of EDICON will be able to meet leading technologists and product specialists and find out about practical engineering solutions, emerging technologies and enhancing physical design.

As gold sponsors, CST has the opportunity to invite customers as special VIP guests, giving them full access to the conference, networking reception, exhibitions, plenary sessions, workshops and expert panels. 
Peer-reviewed technical presentations will address topics like:
  • High-speed digital design
  • Data conversion
  • GaN
  • GaAs and RF CMOS semiconductors
  • Envelope tracking and pre-distortion linearization
  • MIMO over-the-air testing
  • Carrier aggregation
We only have a few special VIP guest passes to give away, but we’re looking forward to meeting many of you there. For more information on how you can be one of our special guests, e-mail us directly: events (at)

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