Sunday, March 10, 2013

Hands-on at EDI CON 2013

EDI CON 2013 is ready to begin. With an impressive conference schedule and a variety of technical tracks and presentations, hands-on practical solutions are definitely going to be a highlight of the show. CST is proud to be a gold sponsor of EDI CON, the inaugural conference for the high-frequency and high-speed electronics industry in China, and as gold sponsors, many of us will be heading out to Beijing, hoping to meet you at the exhibition hall and presentations.

As well as presenting CST STUDIO SUITE® at booth #251, we will be actively participating throughout the event. The three technical tracks will feature technical sessions with papers from invited contributors, and our sales and technical support manager for CST South East Asia Pty Ltd, Klaus Krohne, has been invited to co-chair the second technical track session: Measurement & Modeling. 
 
There will also be an opportunity to discover the practical applications of CST’s simulation software through the following sessions: 
  • CST MICROWAVE STUDIO® Workshop – Integrated Antenna Design for a GSM Tracking Device
Wednesday March 13, 15:30 – 16:10 (Room D)
A common strategy when designing an electronic communication device is to use an off-the-shelf antenna. However, the designer is limited to commercially available antennas. In this workshop we aim to illustrate how an existing chip antenna on a GSM tracking device can be replaced by an embedded, integrated antenna. The workshop will show how the design capabilities of Antenna Magus, a searchable database of antennas, can be combined with the full-wave 3D electromagnetic simulation tools in CST STUDIO SUITE to create an embedded design which takes into account the full coupling in a complex environment.
  • EDA Design Panel – Standard and Expert Tools in the Industrial EDA/EMC Design Flow
Thursday March 14, 17:15 – 18:00 (Room B)
In order to master the increasing complexity and performance of modern electronic devices, design engineers use simulation tools to an ever greater extent. Employing electromagnetic simulation tools earlier in the design process helps to ensure compliance with specifications and standards before prototypes are built. The feasibility of such simulations is promoted through robust import-filters, automated construction in 3D including component placement, and solver technologies that can deal with the detail richness of state-of-the-art devices.
 
We’ll also be looking forward to attending eASIC and Continental Automotive GmbH’s presentations:
  • 3D EMC Simulation of Automotive Multimedia Systems
Wednesday March 13, 11:20 – 11:40 (Room B)
A key challenge in automotive product design is the compliance to electromagnetic compatibility (EMC) and interference (EMI) requirements in a cost-driven project environment. Traditionally, EMC and EMI issues are solved in the EMC lab, often without getting a full understanding of the underlying effects. The adoption of 3D field simulation provides an insight into the root causes of electromagnetic resonance effects occurring in the product, enabling fast design cycles and high product quality. This presentation shows an example of using 3D EM simulation for solving a GSM immunity issue. After setting up a model with the relevant electrical and mechanical components, a combination of several effects that introduce disturbances to the system has been found. The system could then be optimized within a few days by simulating the whole device architecture, leading to a reliable and cost-effective solution.
  • Measurement and Modeling Technical Session – High Speed IA: Signal Lines to Power Plane Coupling Caused by Common Mode Current in High Speed SerDes Interconnect Design
Thursday March 14, 08:30 – 08:50 (Room B)
One of the main problems in the design of high speed printed circuit boards (PCB) and package substrate is the uncontrolled path of the return current, which couples to power planes and leads to both signal integrity (SI) and electromagnetic interference (EMI) problems. A real design is investigated with numerical simulation to prove that the concept of common mode insertion loss offers an indicator of uncontrolled return current and demonstrate its impact on the signal performance of high speed interconnects.
 
These presentations offer a sample of the practical hands-on solutions on show at EDI CON 2013. You can plan your schedule now by having a look at the full abstracts in the conference program, and don't forget to download the detailed floor plan to make sure you know how to make your way to booth #251.

No comments:

Post a Comment