Friday, April 4, 2014

CST to Showcase EM Simulation Tools at EDI CON 2014

We are going to Beijing to visit the Electronic Design Innovation Conference (EDI CON) from April 8-10, 2014 – a show focusing on the high-frequency and high-speed electronics industry. As gold sponsors of the conference, we will be presenting workshops that look at how electromagnetic (EM) simulation can be used when designing electronic devices, touching on topics such as high-speed and signal integrity analysis as well as EMC/EMI design.

The best place to find us is at booth no. 117, but we’ll also be participating in the technical conference and co-chairing the measurement and modeling track.

Check out our schedule for the show:
  • MIMO Antenna System Simulation
Tuesday 8 April, 15:30 – 16:15 (Room D, 203 B)
Multiple-input, multiple-output (MIMO) systems are a major field of study for researchers interested in achieving high data rate communication in typical urban multi-path environments. Although a fast analysis can be based on S-parameters, this approach has limitations. A more detailed analysis needs to take into account broadband, farfield and antenna properties. These are especially important in presence of the human body. This workshop will show how simulation can be used to calculate the effect of hand and head (e.g. CTIA models) on mobile devices, MIMO for wearable antennas and different power weighting functions for different environments, along with post-processing options for envelope correlation (including spatial power weighting functions), derived quantities  diversity gain and multiplexing efficiency. Finally, there will be a demonstration of the link between CST MICROWAVE STUDIO® and Optenni Lab for multiple antenna matching to optimize power transfer to antennas while minimizing cross-coupling.
  • High-Speed and High-Power Connector Design
Wednesday 9 April, 9:15 – 9:35 (Room E, 203 C)
As data transfer rates increase and complexity grows, designing high-speed connectors is becoming increasingly challenging, especially with multiple compliance regulations to meet. A precise analysis of the connector in isolation as well as the connector and PCB interface is essential, and can be only achieved by extensive use of 3D EM simulation during the development cycle. Multiple examples, including display connectors and USB 3.0 connectors will be used to demonstrate features such as online TDR and cross-probing, with the aim of identifying impedance mismatches and discontinuities. A low-speed high-power connector analysis using multidisciplinary approaches (including electrical and thermal effects) will also be presented.
  • Simulation and Measurement: Complementary Design Tools
Wednesday 9 April, 13:30 – 14:15 (Room D, 203 B)
The usual aim of electromagnetic simulation in design is to lower the number of prototypes to reduce costs and time to market. However, this is only possible when the EM simulator is given the correct input data that accurately represents the physical device. Then an excellent agreement between simulation and measurement can be expected. There are many possible causes of discrepancies between the two, including geometric differences (over-etching, over-milling, rounded corners), material properties (anisotropic dielectrics, surface roughness), installed performance (surrounding structures) and feed discrepancies (connector modeling). In this workshop we will explore the relationship between simulation, using CST STUDIO SUITE®, and measurement, and explain what each domain is best suited for. In some situations measurement can be difficult to perform while simulation is simpler, and vice versa. Simulation allows many variations on a design to be investigated, using techniques such as parameter sweeps, sensitivity and yield analysis. We will show how simulation can be used for what-if analysis and feasibility studies at early stage of design before first prototypes. Finally, the use of measured data to calibrate simulation will be shown. This is useful for hard-to-model phenomena like surface roughness or for the modeling of low-cost adapters.
  • EDA Design Flow Panel
Thursday 10 April, 14:15 – 15:00 (Room B, 201 D)
We will be participating in this panel session.

If you happen to be in Beijing for the show, remember to drop by booth no. 117 for a chat or head to one of our workshops to get more insight on electromagnetic simulation.

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